Mai, Carsten

[["dc.bibliographiccitation.firstpage","658"],["dc.bibliographiccitation.issue","6"],["dc.bibliographiccitation.journal","Forests"],["dc.bibliographiccitation.volume","11"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Mai, Carsten"],["dc.contributor.author","Slabohm, Maik"],["dc.contributor.author","Gschweidl, Florian"],["dc.contributor.author","Schwarzenbrunner, Ronald"],["dc.date.accessioned","2021-04-14T08:25:06Z"],["dc.date.available","2021-04-14T08:25:06Z"],["dc.date.issued","2020"],["dc.identifier.doi","10.3390/f11060658"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/81523"],["dc.language.iso","en"],["dc.notes.intern","DOI Import GROB-399"],["dc.publisher","MDPI"],["dc.relation.eissn","1999-4907"],["dc.rights","https://creativecommons.org/licenses/by/4.0/"],["dc.title","The Staining Effect of Iron (II) Sulfate on Nine Different Wooden Substrates"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","303"],["dc.bibliographiccitation.issue","3"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","311"],["dc.bibliographiccitation.volume","67"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Stohldreier, Roman"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T11:25:59Z"],["dc.date.available","2018-11-07T11:25:59Z"],["dc.date.issued","2009"],["dc.description.abstract","Wood chips were treated with alkyl ketene dimer (AKD) using three different processes to impart water resistance to particleboards. In the first process, AKD was blended with UF resin. Thickness swelling and water uptake after a 24 h immersion period (20 and 69%) were lower than in the control boards (28 and 81%) but were higher than in the paraffin references (10 and 22%). In process 2, AKD and UF resin were sprayed separately on the chips resulting in a greater reduction of thickness swelling (15%) and water uptake (49%) than in process 1. Paraffin references revealed a thickness swelling and water uptake of 7 and 25%, respectively. An extension of the pressing time in processes 1 and 2 did not increase water repellence. In process 3, particleboards were made from AKD-treated chips that were cured at 130 A degrees C (24 h) prior to gluing. They showed a thickness swelling of 7% and a water uptake of 25%, whereas particleboards with paraffin exhibited levels of 8 and 29%. The thickness swelling and water uptake of boards with AKD increased when the curing time was reduced from 24 to 12 to 6 h (130 A degrees C). Changing the curing temperature from 130 to 100 A degrees C (12 h) had no effect on board properties. The IB of boards made from pre-cured chips with AKD (24 h/130 A degrees C) was 44% lower than in controls and 35% lower than in paraffin references. This indicates that AKD impedes the adhesion."],["dc.description.sponsorship","\"Deutsche Bundesstiftung Umwelt\" ( DBU)"],["dc.identifier.doi","10.1007/s00107-009-0309-1"],["dc.identifier.isi","000268310100008"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?goescholar/3471"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/56756"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","Procedural influence on the properties of particleboards made from AKD modified chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","143"],["dc.bibliographiccitation.issue","2"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","149"],["dc.bibliographiccitation.volume","68"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T08:43:32Z"],["dc.date.available","2018-11-07T08:43:32Z"],["dc.date.issued","2010"],["dc.description.abstract","Alkyl ketene dimer (AKD) was used as a hydrophobic agent for PF-bonded particleboards. In contrast to conventionally used paraffin, AKD can be covalently bonded to the chip surface by esterification with wood hydroxyl groups. FTIR analyses before and after toluene extractions indicated that only a small amount of the applied AKD is chemically bonded. Wettability studies on veneer strips suggested that particularly the bonded AKD accounts for the surface hydrophobicity. A subsequent spraying of AKD and PF resin on the chips that were pressed for 15, 30, and 60 saEuro-mm(-1) (Process 1) did not result in decreased thickness swelling and water uptake as compared to the control boards. In Process 2, chips were cured (130 A degrees C/6, 12, 24 h) prior to pressing (15 saEuro-mm(-1)) which did not impart significant hydrophobicity either. The low efficacy of AKD as hydrophobic agent in Process 1 is attributed to the hydrolysis of AKD by water vapor during pressing. The low hydrophobic effect of AKD in Process 2 is ascribed to a saponification of esters between AKD and wood hydroxyl groups by the alkaline PF resin."],["dc.description.sponsorship","\"Deutsche Bundesstiftung Umwelt\" (DBU)"],["dc.identifier.doi","10.1007/s00107-009-0358-5"],["dc.identifier.isi","000277138900004"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?gs-1/6691"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/19989"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","PF-bonded particleboards from AKD-modified chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","37"],["dc.bibliographiccitation.issue","1"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","45"],["dc.bibliographiccitation.volume","67"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T08:33:00Z"],["dc.date.available","2018-11-07T08:33:00Z"],["dc.date.issued","2009"],["dc.description.abstract","The study objective was to impart urea-formaldehyde (UF) bonded particleboards higher and longer-lasting hydrophobicity than that resulting from conventionally used paraffin. Alkyl ketene dimer (AKD) is a paper sizing agent that can theoretically esterify wood compounds and result in a surface modification. Particles were 1) impregnated with an aqueous AKD-solution and cured at 130 degrees C prior to gluing, or 2) sprayed with a mixture of AKD-solution and UF-resin in a single step. Boards with and without paraffin wax were used as controls. Thickness swelling after 2, 24, and 48 h immersion was decreased by 90, 62, and 59% when the chips were impregnated with AKD in comparison to untreated control boards. Water uptake after 2, 24, and 48 h was reduced by 91, 75, and 60%. AKD-impregnation with subsequent curing decreased the internal bond strength by 53%, indicating that AKD impedes the adhesion. The mixture of AKD and UF-glue did not result in considerable hydrophobicity. Increased methyl/methylene and carbonyl bands in FTIR-spectra after toluene-extraction suggest that AKD partially formed ester bonds at the wood surface."],["dc.identifier.doi","10.1007/s00107-008-0275-z"],["dc.identifier.isi","000267042700006"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?goescholar/3466"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/17468"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","Use of alkyl ketene dimer (AKD) for surface modification of particleboard chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]