Mai, Carsten

[["dc.bibliographiccitation.firstpage","658"],["dc.bibliographiccitation.issue","6"],["dc.bibliographiccitation.journal","Forests"],["dc.bibliographiccitation.volume","11"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Mai, Carsten"],["dc.contributor.author","Slabohm, Maik"],["dc.contributor.author","Gschweidl, Florian"],["dc.contributor.author","Schwarzenbrunner, Ronald"],["dc.date.accessioned","2021-04-14T08:25:06Z"],["dc.date.available","2021-04-14T08:25:06Z"],["dc.date.issued","2020"],["dc.identifier.doi","10.3390/f11060658"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/81523"],["dc.language.iso","en"],["dc.notes.intern","DOI Import GROB-399"],["dc.publisher","MDPI"],["dc.relation.eissn","1999-4907"],["dc.rights","https://creativecommons.org/licenses/by/4.0/"],["dc.title","The Staining Effect of Iron (II) Sulfate on Nine Different Wooden Substrates"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","25"],["dc.bibliographiccitation.issue","2"],["dc.bibliographiccitation.journal","WOOD RESEARCH"],["dc.bibliographiccitation.lastpage","37"],["dc.bibliographiccitation.volume","55"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T08:48:41Z"],["dc.date.available","2018-11-07T08:48:41Z"],["dc.date.issued","2010"],["dc.description.abstract","Wood chips were first sprayed with pure alkenyl succinic anhydride (3 % wt/wt) and then cured (130 degrees C. h(-1)) with the objective to impart water repellency to UF-bonded particleboards. Unlike conventionally used paraffin wax, the anhydride can be covalently anchored to the chip surface by esterifying wood hydroxyl groups; however, the treatment resulted in increased thickness swelling (67%) after 2 h water submersion and decreased internal bond strength (IB; 0.10 N mm(-2)) as compared to controls (21 % and 0.95 N mm(-2)). Wettability studies revealed that the surface polarity was increased after the anhydride treatment. FTIR analyses before and after extraction of non-bonded anhydrides showed that esterification did not occur during the curing step. Viscosity measurements indicated that the non-bonded anhydride on the chip surface was hydrolyzed to a dicarboxylic acid by the aqueous glue, which in turn induced premature condensation before pressing and affected bonding. Investigations on veneer strips suggested that an esterification requires a solvent to provide the anhydride certain mobility for orientation. The hydrophobicity of pure alkenyl succinic anhydride seems to impair the attachment to wood hydroxyl groups and the spreading over the polar chip surface."],["dc.identifier.isi","000280247000004"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/21277"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Slovak Forest Products Research Inst"],["dc.relation.issn","1336-4561"],["dc.title","TREATMENT OF PARTICLEBOARD CHIPS WITH ALKENYL SUCCINIC ANHYDRIDE"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","303"],["dc.bibliographiccitation.issue","3"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","311"],["dc.bibliographiccitation.volume","67"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Stohldreier, Roman"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T11:25:59Z"],["dc.date.available","2018-11-07T11:25:59Z"],["dc.date.issued","2009"],["dc.description.abstract","Wood chips were treated with alkyl ketene dimer (AKD) using three different processes to impart water resistance to particleboards. In the first process, AKD was blended with UF resin. Thickness swelling and water uptake after a 24 h immersion period (20 and 69%) were lower than in the control boards (28 and 81%) but were higher than in the paraffin references (10 and 22%). In process 2, AKD and UF resin were sprayed separately on the chips resulting in a greater reduction of thickness swelling (15%) and water uptake (49%) than in process 1. Paraffin references revealed a thickness swelling and water uptake of 7 and 25%, respectively. An extension of the pressing time in processes 1 and 2 did not increase water repellence. In process 3, particleboards were made from AKD-treated chips that were cured at 130 A degrees C (24 h) prior to gluing. They showed a thickness swelling of 7% and a water uptake of 25%, whereas particleboards with paraffin exhibited levels of 8 and 29%. The thickness swelling and water uptake of boards with AKD increased when the curing time was reduced from 24 to 12 to 6 h (130 A degrees C). Changing the curing temperature from 130 to 100 A degrees C (12 h) had no effect on board properties. The IB of boards made from pre-cured chips with AKD (24 h/130 A degrees C) was 44% lower than in controls and 35% lower than in paraffin references. This indicates that AKD impedes the adhesion."],["dc.description.sponsorship","\"Deutsche Bundesstiftung Umwelt\" ( DBU)"],["dc.identifier.doi","10.1007/s00107-009-0309-1"],["dc.identifier.isi","000268310100008"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?goescholar/3471"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/56756"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","Procedural influence on the properties of particleboards made from AKD modified chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","143"],["dc.bibliographiccitation.issue","2"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","149"],["dc.bibliographiccitation.volume","68"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T08:43:32Z"],["dc.date.available","2018-11-07T08:43:32Z"],["dc.date.issued","2010"],["dc.description.abstract","Alkyl ketene dimer (AKD) was used as a hydrophobic agent for PF-bonded particleboards. In contrast to conventionally used paraffin, AKD can be covalently bonded to the chip surface by esterification with wood hydroxyl groups. FTIR analyses before and after toluene extractions indicated that only a small amount of the applied AKD is chemically bonded. Wettability studies on veneer strips suggested that particularly the bonded AKD accounts for the surface hydrophobicity. A subsequent spraying of AKD and PF resin on the chips that were pressed for 15, 30, and 60 saEuro-mm(-1) (Process 1) did not result in decreased thickness swelling and water uptake as compared to the control boards. In Process 2, chips were cured (130 A degrees C/6, 12, 24 h) prior to pressing (15 saEuro-mm(-1)) which did not impart significant hydrophobicity either. The low efficacy of AKD as hydrophobic agent in Process 1 is attributed to the hydrolysis of AKD by water vapor during pressing. The low hydrophobic effect of AKD in Process 2 is ascribed to a saponification of esters between AKD and wood hydroxyl groups by the alkaline PF resin."],["dc.description.sponsorship","\"Deutsche Bundesstiftung Umwelt\" (DBU)"],["dc.identifier.doi","10.1007/s00107-009-0358-5"],["dc.identifier.isi","000277138900004"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?gs-1/6691"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/19989"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","PF-bonded particleboards from AKD-modified chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","283"],["dc.bibliographiccitation.issue","3"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","288"],["dc.bibliographiccitation.volume","73"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Kloeser, Lars"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T09:57:57Z"],["dc.date.available","2018-11-07T09:57:57Z"],["dc.date.issued","2015"],["dc.description.abstract","This study focuses on the development of up-scaling of modifications with maleic anhydride (MA) for the production of medium density fibreboards (MDF). In order to assess the effect of MA modification on the wood itself, preliminary investigations were carried out on spruce veneer strips treated with 10 (wt v(-1)) MA in dimethylsulfoxide (DMSO) prior to fibre modification and board manufacture. The veneers were cured at 150 A degrees C and showed cell wall bulking and anti-swell efficiency (ASE) of 2.3 +/- A 0.2 and 22 +/- A 3 % (mean value +/- A std), respectively, due to MA-treatment. Fibres treated with MA in DMSO and cured at 160 A degrees C were pressed to MDF by using polymeric diphenyl-methane-diisocyanate (PMDI) as adhesive. These boards showed a modulus of rupture and modulus of elasticity reduced by 50 and 20 % compared to those of control boards. Internal bond strength (IBS) and IBS after cook test of MA-treated MDF were approximately twofold and threefold higher than those of control boards. MA-treatment induced a minor reduction in water thickness swelling, but not in water uptake of the MA-treated MDF. The results indicate that MA-modifications cause severe degradation of the cell wall and do not result in considerable hydrophobation of solid wood and MDF, but improve bonding with PMDI."],["dc.identifier.doi","10.1007/s00107-015-0888-y"],["dc.identifier.isi","000353294300001"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/37273"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","1436-736X"],["dc.relation.issn","0018-3768"],["dc.title","Usability of maleic anhydride as wood modification agent for the production of medium density fibreboards (MDF)"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dspace.entity.type","Publication"]]

[["dc.bibliographiccitation.firstpage","37"],["dc.bibliographiccitation.issue","1"],["dc.bibliographiccitation.journal","European Journal of Wood and Wood Products"],["dc.bibliographiccitation.lastpage","45"],["dc.bibliographiccitation.volume","67"],["dc.contributor.author","Hundhausen, Ulrich"],["dc.contributor.author","Militz, Holger"],["dc.contributor.author","Mai, Carsten"],["dc.date.accessioned","2018-11-07T08:33:00Z"],["dc.date.available","2018-11-07T08:33:00Z"],["dc.date.issued","2009"],["dc.description.abstract","The study objective was to impart urea-formaldehyde (UF) bonded particleboards higher and longer-lasting hydrophobicity than that resulting from conventionally used paraffin. Alkyl ketene dimer (AKD) is a paper sizing agent that can theoretically esterify wood compounds and result in a surface modification. Particles were 1) impregnated with an aqueous AKD-solution and cured at 130 degrees C prior to gluing, or 2) sprayed with a mixture of AKD-solution and UF-resin in a single step. Boards with and without paraffin wax were used as controls. Thickness swelling after 2, 24, and 48 h immersion was decreased by 90, 62, and 59% when the chips were impregnated with AKD in comparison to untreated control boards. Water uptake after 2, 24, and 48 h was reduced by 91, 75, and 60%. AKD-impregnation with subsequent curing decreased the internal bond strength by 53%, indicating that AKD impedes the adhesion. The mixture of AKD and UF-glue did not result in considerable hydrophobicity. Increased methyl/methylene and carbonyl bands in FTIR-spectra after toluene-extraction suggest that AKD partially formed ester bonds at the wood surface."],["dc.identifier.doi","10.1007/s00107-008-0275-z"],["dc.identifier.isi","000267042700006"],["dc.identifier.purl","https://resolver.sub.uni-goettingen.de/purl?goescholar/3466"],["dc.identifier.uri","https://resolver.sub.uni-goettingen.de/purl?gro-2/17468"],["dc.notes.intern","Merged from goescholar"],["dc.notes.status","zu prüfen"],["dc.notes.submitter","Najko"],["dc.publisher","Springer"],["dc.relation.issn","0018-3768"],["dc.rights","Goescholar"],["dc.rights.uri","https://goescholar.uni-goettingen.de/licenses"],["dc.title","Use of alkyl ketene dimer (AKD) for surface modification of particleboard chips"],["dc.type","journal_article"],["dc.type.internalPublication","yes"],["dc.type.peerReviewed","yes"],["dc.type.status","published"],["dc.type.version","published_version"],["dspace.entity.type","Publication"]]